Teledyne FLIR mid-wave infrared (MWIR) and longwave infrared (LWIR) camera modules are designed for easy and efficient integration into higher-level assemblies and platforms. With industry-leading reliability, performance, size, weight, and power, they are ideal for OEM applications in defense, commercial, and security applications.

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FLIR AVP

SWaP-Optimized SOM for Prism

The AVP, a size, weight, and power (SWaP) optimized advanced video processor, provides best-in-class artificial intelligence performance for thermal infrared and visible camera perception systems. It incorporates the latest Qualcomm® QCS8550, the industry’s most advanced mobile processor system on chip (SoC) featuring up to 48 TOPS inference compute performance. The QCS8550 is part of Qualcomm’s Product Longevity Program, ensuring future-proof product stability.

The AVP is designed to efficiently run Teledyne FLIR Prism AI software providing detection, classification, and target tracking and Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction. Prism software runs efficiently on the AVP leveraging the available system on module (SoM) functions to provide critical edge AI capabilities for automotive, airborne, unmanned, counter-UAS (CUAS), perimeter security, and intelligence, surveillance, and reconnaissance (ISR) applications.

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Prism™ Development Kit for Qualcomm® RB5

Prism Software and IR Camera Evaluation Kit

The Prism Development Kit for Qualcomm RB5 enables system engineers to evaluate Prism ISP and Prism AI with the output of Teledyne FLIR’s Hadron™ thermal imaging camera modules. Prism ISP software includes image fusion, super resolution, turbulence mitigation, electronic imaging stabilization, 16-to-8-bit tone mapping, and local contrast enhancement (LCE). Prism AI features a mature perception software that includes object classification, object detection, object tracking, and fine-grained classification trained on the world’s largest thermal image data lake with over 5 million annotation assets.

The development kit includes Teledyne FLIR’s Hadron dual visible and thermal camera module, all necessary cables, and the Qualcomm Robotics RB5 QRB5165 system on chip (SoC), the most popular and efficient mobile processor for digital imaging, bringing unprecedented capabilities to Teledyne FLIR thermal camera module integrators.

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